Glass Frit for Laser-sealing
Achieving high-precision sealing
Glass Frit for Laser-sealing enables hermetic sealing of glass substrates and dissimilar materials such as alumina, LTCC, and silicon, as well as sealing glass substrates to each other. It is ideal for devices that require high reliability, as it prevents thermal damage to the device during sealing.
Features
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Prevents thermal damage to internal devices
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High reliability of hermetic sealing
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Glass lid with glass frit is available.
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Support provided for creating prototype conditions for laser sealing
Laser-sealing Process
Applications
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Micro Electro Mechanical Systems (MEMS) packages
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Deep UV LED packages
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Hermetic sealing for packages
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OLED devices
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Perovskite solar cells
Available Cavity Materials and Sizes
| Cavity material | Package/Substrate size | Glass lid thickness |
|---|---|---|
| LTCC | ～60mm | ～1mm |
| Alumina | ～60mm | ～0.5mm |
| Glass | ～200mm | ～1mm |
| Silicon | ～10mm | ～0.2mm |
Supply Form and Process
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Prototype supply is available in the following forms.
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Process simplification on the user's side is possible.
1. Provide a prototype package laser sealed by NEG
2. Supply glass lids with glass frit printed and fired (laser sealing is performed by the user)
Glass lids with sintered laser glass frit are available in a range of options to match various coefficients of thermal expansion.
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