Granulated Glass for Metal Packages

Granulated glass with excellent flowability and fillability, ideal for tablet forming process

Glass for matching seals is used with Kovar stems and leads, while those for compression seals are used with iron or stainless steel stems and leads of iron-nickel, iron-chrome alloys or Kovar. Glass for part support is used for stand-off.

Properties

Usage Seal Part support
Compression seal Matching seal Standoff
Glass code ST-W/K ST-4W/K FN-13W/K BH-W/K BH-7W/K BH-8W/K BH-14W/K ST-4F/K BH-FW/K
Particle size D50 μm 135 130 110 135 135 135 135 120 125
D99 265 250 215 265 265 265 265 235 245
Firing temperature:  T1 650~660 680~690 700~710 670~680 730~750 650~660 750~800
Sealing temperature:  T2 960 980 930 980 960 1050
Coefficient of thermal expansion 30~380℃ ×10-7/K 95 95 75.5 45.5 49.5 62.5 31.5 94 57
Density ×103kg/m3 2.60 2.60 2.51 2.28 2.32 2.41 2.13 2.65 2.83
Transformation point 450 460 510 470 505 510 - 460 515
Deformation point 510 520 570 550 565 570 - 520 635
Strain point 420 427 480 435 472 475 - - -
Annealing point 460 472 517 480 513 520 - - -
Softening point 663 672 687 698 715 685 782 - -
Working point 980 1030 990 1050 1130 990 1090 - -
Dielectric constant 1MHz 25℃   6.4 6.5 6.3 5.0 5.5 5.8 4.0 6.7 6.4
tan δ 1MHz 25℃ ×10-4 22 21 32 30 39 37 3 24 31
Volume resistivity Log ρ 150℃ Ω・cm 11.4 11.2 11.2 11.5 10.8 11.1 15.5 11.4 -
250℃ 8.8 8.7 8.7 8.8 8.2 8.5 12.3 8.8 -
350℃ 6.9 7.0 7.0 7.0 6.4 6.8 10.2 7.0 -
Young’s modulus GPa 68 68 - 57 57 - - - -
Poisson’s ratio 0.21 0.21 - 0.22 0.22 - - - -
Glass type Na2O・BaO・SiO2 Na2O・Al2O3・B2O3・SiO2 Na2O・BaO・SiO2 Na2O・Al2O3・B2O3・SiO2
Application Fe, Fe-Ni, Fe-Cr, Fe-Ni-Cr Fe
Kovar
Kovar
Mo
Fe Kovar
  • ST-4F/K and BH-FW/K are composite glass (glass-ceramic).
  • Please contact us about color variations.

Application examples

  • Pressing
    The appropriate molding pressure is 8 to 10 MPa. Tablets molded at this pressure offer sufficient green strength, with a porosity of 0.35 to 0.37, and allow for easy thermal decomposition of the binder during the pre-firing process.
  • Pre-firing
    Pre-firing is carried out in an oxidizing atmosphere such as oxygen or air. Refer to T1 in the property table above for the pre-firing temperature. Binder decomposition begins at 150°C and completes around 530°C, so the temperature increase rate in this range should be less than 15°C/min. Following the pre-firing schedule in Figure 1, the shrinkage of a tablet molded at 8 to 10 MPa pressure will be between 13.5% and 14.5%.
Figure 1 Pre-firing profile
figure of pre-firing profile
  • Sealing
    Sealing is carried out in nitrogen atmosphere. Refer to T2 in the property table above for the appropriate sealing temperature.
Figure 2 Sealing profile
figure of sealing profile
Figure 3 Viscosity
figure of viscosity
Figure 4 Thermal expansion
figure of thermal expansion

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