Semiconductor

Its high light transmittance, excellent thermal expansion properties, and exceptional planarity play a key role in advancing semiconductor processes and technologies.

Product List

Manufacturing Process Components

Crucial in the semiconductor manufacturing process.

Glass Wafer for Supporting Semiconductors

These high-precision carrier substrates support chips and other components in the semiconductor packaging process. We offer a wide range of glass, from low to high expansion, and can provide glass tailored to the requested coefficient of thermal expansion.

Semiconductor Components

Contribute to the enhanced performance of semiconductor devices.

Glass Wafer for CSP

Low expansion, alkali-free, and polishing-free glass wafers are used for the cover glass of Wafer Level Chip Size Package (WLCSP) CMOS image sensors.
Inorganic Core Substrate for Semiconductor Packaging

Inorganic Core Substrate for Semiconductor Packaging

It is an inorganic core substrate used in next-generation semiconductor packages. There are glass-ceramic and glass substrates, which contribute to semiconductor package design.

Composite Powder for Low Temperature Cofired Ceramics

Composite Powder for Low Temperature Cofired Ceramics (LTCC) can be fired at 870 to 900°C. This allows the use of gold or silver paste, which offer high electrical conductivity, for the inner layer conductor—resulting in circuit substrates with excellent electrical properties.