Glass Wafer for Supporting Semiconductors

High-precision glass substrates available in a wide range, from low to high expansion

These high-precision carrier substrates support chips and other components in the semiconductor packaging process. We offer a wide range of glass, from low to high expansion, and can provide glass tailored to the requested coefficient of thermal expansion.

Features
Properties
Applications

Features

Wide range of products from low to high expansion
TTV^*1 <1 μm is possible (Φ12 inch).
T7 code compatible

Total Thickness Variation

Properties

Glass code			ABC-G	A58	A66S	A69	A75	A91S
Coefficient of thermal expansion	20-220℃	ppm/℃	3.6	5.6	6.3	6.6	7.2	8.7
Coefficient of thermal expansion	20-260℃	ppm/℃	3.7	5.7	6.4	6.7	7.3	8.8
Young’s modulus		GPa	73	70	77	74	75	70
Dielectric constant	1MHz, 25℃		5.3	6.2	6.5	6.8	6.9	7.7
tan δ	1MHz, 25℃		0.001	0.02	0.01	0.01	0.01	<0.03
Volume Resistivity Log ρ	150℃	Ω・cm	ー	8.1	8.6	8.3	8	7.1
Volume Resistivity Log ρ	250℃	Ω・cm	ー	ー	6.8	ー	6.2	ー