High Heat-resistant and Low Thermal Compaction Glass Substrate: OA-31

Low thermal compaction glass for next-generation displays

Developed as a glass substrate for LTPS displays in smartphones and mobile devices, this low thermal compaction glass significantly reduces shrinkage during heat treatment compared to conventional products. With outstanding surface quality and uniform thickness achieved through the overflow process, it is an ideal substrate for next-generation displays and flexible OLED displays.

Applications
Features
Specifications

Applications

Smartphone displays
Mobile device displays

Features

Low thermal compaction
Offers excellent thermal dimensional stability in ultra-high-temperature processes such as LTPS process.
High Young's modulus
Resistant to deflection and deformation, ensuring stability as a flat glass.
Superior optical properties
High transmittance and exceptional transparency.
High surface quality
Smooth surfaces achieved through the advanced overflow process techniques.
Excellent thickness uniformity
Overflow molding ensures remarkably consistent thickness.

Specifications

Thermal Shrinkage

Transmittance

Properties

Properties/Glass code			OA-31
Density		×10³kg/m³	2.64
Coefficient of thermal expansion	30～380℃	×10^-7/K	39
Strain point		℃	750
Young's modulus		GPa	83
Poisson's ratio			0.25
Vickers hardness	Hv		680
Volume resistivity Logρ	350℃	Ω･cm	13.2
Dielectric constant	1MHz, 25℃		5.9
tanδ	1MHz, 25℃		0.002
Transmittance	λ=550nm	%	91
Refractive index (nd)	587.6nm		1.53
Chemical durability	10%HCl（80℃-60min）		No surface alteration
Chemical durability	63BHF（20℃-3min）		No surface alteration
Alkali oxide content		wt%	0.1 or less
As, Sb content		wt%	Not present (less than 0.1)