Submount with AuSn solder
Submount with AuSn solder
A submount with AuSn solder coating for easy customer mounting; Cu/Mo laminate substrates offer higher thermal conductivity than CuW and CuMo, while Graphite+Cu provides even higher ultra-high thermal conductivity properties.
Features
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Reliable and strong joint strength
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Composition ratio of gold and tin and thickness can be adjusted
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Composition of base coating (metallization coating) can be adjusted.
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Pattern deposition can be applied.
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Material can be selected according to the desired properties.
Applications
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Heat sinks for high-power LDs
Material Properties
| Substrate | Content ratio | Thermal conductivity (W/m-K) | Coefficient of thermal expansion （×10-6/℃） |
|
|---|---|---|---|---|
| Coating thickness direction | Surface direction | |||
| CuW | W 90wt% | 174 | 174 | 6.4 |
| W 80wt% | 206 | 206 | 8.3 | |
| CuMo | Mo 85wt% | 130 | 130 | 6.6 |
| Mo 65wt% | 207 | 207 | 8.0 | |
| Cu/Mo stacked substrate | Mo 40wt%*1 | 230 | 220 | 6.6 |
| Mo 20wt% | 291 | 334 | 7.4 | |
| Mo 10wt% | 335 | 369 | 11.8 | |
| Mo 5wt% | 362 | 381 | 14.8 | |
| Graphite+Cu*2 | ー | 50 | 800 | 4.0-8.0 |
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Cu/Mo stacked substrate with Mo 40wt% shows higher thermal conductivity than CuW and CuMo with the same CTE.
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Graphite+Cu has ultra-high thermal conductivity of 800W/m-K while matching CTE to LD chips.
Specification Example
Dimensions (mm)
A=1.50, B=10.00, C=0.25
Composition ratio
Au : Sn = 78 : 22 (wt%)
Coating thickness
5μm
Event Information
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